Thermal Insulated Metal Substrates

thermal insulated metal substrate

Thermal insulated metal substrates (TIMS) are metal core circuit boards used to increase thermal dissipation in high wattage surface mount applications. The metal core acts as a heatsink and is available in several thicknesses while the insulated circuit layers on one or both sides are available with 1, 2 or 4 ounce copper foil.

Segue can offer a bare TIMS circuit board made to print, or a fully loaded TIMS assembly, tested and ready for production. The TIMS combine the advantages of metal framing with PCB assembly. This specialized process, using only the highest quality metals, limits the need to use multiple parts while achieving maximum insulation in minimum space. Some examples of applications include LED packaging and compact power supply conversion equipment where challenging thermal management is present. The product advantages and benefits can be gained to:

  • Achieve high density space requirement for surface mount designs
  • Manages heat dissipation in circuit broad design
  • Improves product reliability
  • Replaces fragile ceramic components
  • Reduces hardware and assembly cost